LC25WZ*A

2.5Gb/s Buried Het Laser non-WDM applications

Datasheet

This laser module employs the strained layer MQW Buried Heterostructure DFB laser chip, and has been designed specifically for use in 2.5Gb/s long distance single channel optical fiber systems. The device is packaged in a hermetically sealed 14-pin butterfly package incorporating an isolator and monitor photodiode for control of the power of the laser over life and all operating conditions

• 2.5Gb/s operation
• Narrow spectral line width
• Internal TEC with precision NTC thermistor for temperature control
• Code reduction with single product for reaches up to 175km
• GaInAsP SLMQW DFB single frequency laser chip
• InGaAs monitor Photodiode
• Hermetically sealed 14-pin butterfly package with optical isolator
• RoHS Compliant

• Long Haul